About
About Me
MicroLED engineer by day, AI tinkerer by night. I lead MicroLED systems architecture at Japan's top LED semiconductor company — FPGA, ASIC, full-stack from spec to production test. My home lab hosts a Raspberry Pi robot arm, ESP32 smart home gadgets, and a voice-recognition AI that sometimes listens. I think about technology through the lens of industry cycles and commercial viability — great engineering should answer 'can this sell, and is it worth building?' Fluent in Chinese, Japanese, English and Korean. Motto: if you can think it, AI can build it 10× faster.
Background
Currently Tech Lead at Japan's leading LED semiconductor company. Driving system architecture and production test infrastructure for ASIC-integrated MicroLED products — from requirements definition to FPGA-based EOL test. Trilingual technical communication (Chinese/Japanese/English) enables cross-border ASIC co-development with partners like Infineon, and direct technical enablement for China Tier 1 customers. Beyond engineering, I spend time studying industry cycles, technology commercialization, and long-term value creation. Conviction: technology divorced from business context is just a hobby.
Experience
2022 - Present
Tech Lead & Systems Architect — MicroLED
Nichia Corporation
Led end-to-end technical development for ASIC-integrated MicroLED product lines at a leading Japanese LED semiconductor company. Responsible for requirements definition, system specification, FPGA (Xilinx) production EOL test system design, and building optical evaluation and thermal evaluation systems (transient thermal resistance / structure function analysis). Trilingual (CN/EN/JP) co-development with overseas ASIC partners such as Infineon, and technical enablement for China Tier 1 customers.
Skills & Expertise
FPGA & Test Systems
Optical & Thermal Evaluation
System Architecture
Multilingual Communication
Interests & Exploration
Social Links
MicroLED Technology
Exploring the core of next-gen display and communication technology
Core Technology
MicroLED size <100μm, self-emissive display, no backlight needed. EQE (External Quantum Efficiency) improvement is the core challenge, with GaN as the mainstream material. Offers ultra-high contrast, extremely low power consumption and nanosecond response time.
AR Applications
Ultra-high brightness (>10,000 nit), ideal for outdoor AR scenarios. Combined with waveguide systems for near-eye displays, it's the core emitter for next-generation AR glasses.
Optical Interconnect
High-speed modulation characteristics (>Gbps), based on Microsoft MOSAIC architecture, offering a new solution for short-distance optical interconnects in data centers with parallel optical transmission capability.
Bonding & Packaging
Cu-Cu hybrid bonding technology for wafer-level integration. Heterogeneous integration with CMOS driver backplanes is key to mass production, breaking through yield and cost bottlenecks.
Industry Status
Apple, Samsung, Sony and other giants are actively deploying in the MicroLED supply chain. First consumer AR glasses expected to enter mass production in 2026-2027.
Vision
Using technical writing to lower the barrier to MicroLED and photonic semiconductor knowledge. Exploring AI Agent-driven engineering automation, tracking open-source EDA toolchains like gdsfactory and OpenROAD. The goal: bridge technical depth, commercialization insight, and long-term thinking. Feel free to reach out via GitHub or Email.