About
About Me
I work on MicroLED systems in Japan, from product requirements and optoelectronic evaluation to FPGA-based production testing. I care about how device performance translates into the experience of using a product, and how a team can deliver it reliably at scale. Outside work, I explore new ideas through open-source tools and personal experiments.
Background
Currently Tech Lead at Japan's leading LED semiconductor company. Driving system architecture and production test infrastructure for ASIC-integrated MicroLED products, from requirements definition to FPGA-based EOL test. I work with overseas ASIC partners such as Infineon in Chinese, Japanese and English, and support sales through technical training and proposals. Beyond engineering, I study industry cycles, technology commercialization and long-term value creation. I consider performance, cost, reliability and the context in which a product will be used together.
Experience
2022 - Present
Tech Lead & Systems Architect — MicroLED
Nichia Corporation
Led end-to-end technical development for ASIC-integrated MicroLED product lines at a leading Japanese LED semiconductor company. Responsible for requirements definition, system specification, FPGA (Xilinx) production EOL test system design, and building optical evaluation and thermal evaluation systems (transient thermal resistance / structure function analysis). Trilingual (CN/EN/JP) co-development with overseas ASIC partners such as Infineon, and technical enablement for China Tier 1 customers.
Skills & Expertise
FPGA & Test Systems
Optical & Thermal Evaluation
System Architecture
Multilingual Communication
Interests & Exploration
Social Links
MicroLED Technology
Exploring the core of next-gen display and communication technology
Core Technology
MicroLED size <100μm, self-emissive display, no backlight needed. EQE (External Quantum Efficiency) improvement is the core challenge, with GaN as the mainstream material. Offers ultra-high contrast, extremely low power consumption and nanosecond response time.
AR Applications
Ultra-high brightness (>10,000 nit), ideal for outdoor AR scenarios. Combined with waveguide systems for near-eye displays, it's the core emitter for next-generation AR glasses.
Optical Interconnect
High-speed modulation characteristics (>Gbps), based on Microsoft MOSAIC architecture, offering a new solution for short-distance optical interconnects in data centers with parallel optical transmission capability.
Bonding & Packaging
Cu-Cu hybrid bonding technology for wafer-level integration. Heterogeneous integration with CMOS driver backplanes is key to mass production, breaking through yield and cost bottlenecks.
Industry Status
Apple, Samsung, Sony and other giants are actively deploying in the MicroLED supply chain. First consumer AR glasses expected to enter mass production in 2026-2027.