> ls /sys/microled/

MicroLED Technology

Exploring the core of next-gen display and communication technology

[SYS.01] CORE TECHNOLOGY

MicroLED size <100μm, self-emissive display, no backlight needed. EQE (External Quantum Efficiency) improvement is the core challenge, with GaN as the mainstream material. Offers ultra-high contrast, extremely low power consumption and nanosecond response time.

[SYS.02] AR APPLICATIONS

Ultra-high brightness (>10,000 nit), ideal for outdoor AR scenarios. Combined with waveguide systems for near-eye displays, it's the core emitter for next-generation AR glasses.

[SYS.03] OPTICAL INTERCONNECT

High-speed modulation characteristics (>Gbps), based on Microsoft MOSAIC architecture, offering a new solution for short-distance optical interconnects in data centers with parallel optical transmission capability.

[SYS.04] BONDING & PACKAGING

Cu-Cu hybrid bonding technology for wafer-level integration. Heterogeneous integration with CMOS driver backplanes is key to mass production, breaking through yield and cost bottlenecks.

[SYS.05] INDUSTRY STATUS

Apple, Samsung, Sony and other giants are actively deploying in the MicroLED supply chain. First consumer AR glasses expected to enter mass production in 2026-2027.

[SYS.06] KEY_SPECIFICATIONS

PIXEL_SIZE:: < 100 μm
BRIGHTNESS:: > 10,000 nit
RESPONSE_TIME:: < 1 ns
EQE_TARGET:: > 50%
MODULATION:: > 1 Gbps